Influence of thermal history on the mechanical properties of carbon fiber–acrylate composites cured by electron beam and thermal processes

• Published in: Composites. Part A, Applied science and manufacturing Vol. 45; no. -; pp. 162 - 172
• Main Authors: Vautard, F., Ozcan, S., Poland, L., Nardin, M., Meyer, H.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01-02-2013; Elsevier
• Subjects: A. Carbon fibers; A. Polymer–matrix composites (PMCs); adhesion; Applied sciences; B. Fiber/matrix bond; B. Interface; carbon; carbon fibers; chemical bonding; Chemical Sciences; Exact sciences and technology; Forms of application and semi-finished materials; free radicals; Laminates; Material chemistry; mechanical properties; Polymer industry, paints, wood; Technology of polymers; temperature; thermal degradation; A. Carbon fibers; A. Polymer–matrix composites (PMCs); B. Fiber/matrix bond; B. Interface; Bulk polymerization; Laminate; Fiber reinforced material; Mineral fiber; Property processing relationship; Composite material; Interface properties; Photopolymerization; Crosslinked polymer; Carbon fiber; Radiochemical polymerization; Adhesivity; Unidirectional fiber material; Bifunctional compound; Electron beam; Mechanical properties; Experimental study; Bending strength; A. Polymer-matrix composites (PMCs); Ultraviolet radiation; Acrylate polymer; Matrix fiber interface; Thermal history
• ISSN: 1359-835X; 1878-5840
• DOI: 10.1016/j.compositesa.2012.08.025

The mechanical properties of an acrylate resin and its carbon fiber composite, as well as the adhesion strength between them, were characterized in the case of thermal and electron beam curing (with and without thermal post-cure). It was shown that the properties of the matrix were similar but that the thermal history during the curing had a direct influence on the type of interactions that were generated at the interface, leading to different level of adhesion strength and level of performance for the associated composites. In the case of a thermal cure, the thermal profile allowed the generation of covalent bonding at the interface by thermal degradation of carboxylic acid functionalities and simultaneous production of radicals at the surface of the fiber. A high level of adhesion strength was obtained, which was not the case for electron beam curing without a thermal post-cure at the appropriate temperature.