In-situ TEM studies of the sintering behavior of copper nanoparticles covered by biopolymer nanoskin

• Published in: Journal of electron microscopy Vol. 59; no. S1; pp. S75 - S80
• Main Authors: Ida, Kiyonobu, Sugiyama, Yasuyuki, Chujyo, Yuki, Tomonari, Masanori, Tokunaga, Tomoharu, Sasaki, Katsuhiro, Kuroda, Kotaro
• Format: Journal Article
• Language: English
• Published: Japan Oxford University Press 01-08-2010; Oxford Publishing Limited (England)
• Subjects: Biopolymers; Chemical synthesis; COMPOSITES; Copper; copper nanoparticle; Covering; Electron microscopy; gelatin; Gelatins; High temperature; in-situ TEM; MICROSTRUCTURES; Nanocomposites; Nanoparticles; Nanostructure; PARTICLES; POLYMERS; printed electronics; SINTERING; TRANSMISSION ELECTRON MICROSCOPY; wiring material
• ISSN: 0022-0744; 1477-9986; 2050-5701
• DOI: 10.1093/jmicro/dfq055

Sintering behavior of copper nanoparticles with a protective layer of gelatin synthesized by wet-chemical process with an average diameter of 45 nm has been observed using in-situ transmission electron microscopy (TEM). Copper nanoparticles were sublimated without sintering at about 925°C at 2.0 × 10−5 Pa, and carbonized gelatin remained and retained the shape of the initial layer of nanoparticles. Copper nanoparticles were sintered without sublimation at about 250°C with between 1.0 × 10−4 and 6.0 × 10−4 Pa of oxygen gas flow. It was found that the surface of the sintered copper was covered by a gelatin layer.