Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges

• Published in: IEEE microwave and wireless components letters Vol. 15; no. 10; pp. 715 - 717
• Main Authors: Yin, W.-Y., Dong, X.T., Junfa Mao, Li, L.-W.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01-10-2005; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Attenuation; Attenuation constant; average power handling capability (APHC); benzocyclobutene (BCB); Capacitance; Circuit properties; Circuits; Dielectric substrates; distributed parameters; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; finite-ground thin-film microstrip lines (FG-TFMLs); Frequency; Frequency ranges; Handling; Inductance; Materials handling; Mathematical models; Metallization; Microelectronic fabrication (materials and surfaces technology); Microstrip; Microstrip lines; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits; Microwaves; Polyimide resins; Polyimides; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Thermal conductivity; Thin films; Transistors; distributed parameters; average power handling capability (APHC); benzocyclobutene (BCB); Metallizing; Attenuation constant; finite-ground thin-film microstrip lines (FG-TFMLs); Thin film; Microstrip line; Microelectronic fabrication; Distributed parameter circuit; Attenuation coefficient; Thermal conductivity; Numerical simulation; Thermal model; Distributed parameter system
• ISSN: 1531-1309; 1558-1764
• DOI: 10.1109/LMWC.2005.856829

Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on benzocyclobutene (BCB) and polyimide films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. It is believed that the proposed approach is useful in the design of practical TFML circuits.