Surface modification of poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA) polyimide by UV photo-oxidation

• Published in: Journal of adhesion science and technology Vol. 20; no. 4; pp. 319 - 334
• Main Authors: Sener, U., Parekh, B., Entenberg, A., Debies, T., Takacs, G. A.
• Format: Journal Article
• Language: English
• Published: Leiden Taylor & Francis Group 01-01-2006; Brill
• Subjects: ADHESION; Applied sciences; BPDA-PDA; Coating, metallization, dyeing; COHESIVE FAILURE; COPPER; Exact sciences and technology; Machinery and processing; PHOTO-OXIDATION; Plastics; POLYIMIDE; Polymer industry, paints, wood; Technology of polymers; UPILEX-S; Polyimide; UV; Adhesivity; Aromatic polymer; Metallizing; adhesion; Experimental study; Property processing relationship; Quantitative surface analysis; Surface treatment; Structure processing relationship; photo- oxidation; cohesive failure; Morphology; Surface properties; BPDA-PDA; Upilex-S; Copper; Photooxidation; Photochemical degradation
• ISSN: 0169-4243; 1568-5616
• DOI: 10.1163/156856106776381776

Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA, Upilex-S) polyimide (PI), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a small change in surface morphology following treatment. XPS showed an
approximate doubling of the O/C ratio on the modified surfaces which appeared mostly as the carbonyl moiety. UV photo-oxidation degraded Upilex-S to produce a locus of failure below the interface (cohesive failure). XPS and TOF-SIMS results indicated that the Upilex-S thickness remaining on
sputtered Cu after the tape test on the Cu-modified surface was ≤ 10 nm. Cohesive failure occurred at shorter treatment times when Cu was sputter coated on modified BPDA-PDA than on poly(pyromellitic dianhydide-oxydianiline) (PMDA-ODA) PI.