Interfacial reaction issues for lead-free electronic solders Lead-free electronic solders

• Published in: Journal of materials science. Materials in electronics Vol. 18; no. 1-3; pp. 155 - 174
• Main Authors: HO, C. E, YANG, S. C, KAO, C. R
• Format: Journal Article
• Language: English
• Published: Norwell, MA Springer 01-03-2007; Springer Nature B.V
• Subjects: Applied sciences; Copper; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Interface reactions; Intermetallics; Nickel; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Soldering; Solders; Spalling; Studies; Tin; Performance evaluation; Integrated circuit bonding; Growth rate; Soldered joint; Nickel; Interface reaction; Void; Copper; Gain
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-006-9031-5

The interfacial reactions between Sn-based solders and two common substrate materials, Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu have been studied for several decades, and currently there are still many un-resolved issues. The reactions between Sn-based solders and Ni are equally challenging. Recent studies further pointed out that Cu and Ni interacted strongly when they were both present in the same solder joint. While this cross-interaction introduces complications, it offers opportunities for designing better solder joints. In this study, the Ni effect on the reactions between solders and Cu is discussed first. The presence of Ni can in fact reduce the growth rate of Cu sub(3)Sn. Excessive Cu sub(3)Sn growth can lead to the formation of Kirkendall voids, which is a leading factor responsible for poor drop test performance. The Cu effect on the reactions between solders and Ni is then covered in detail. The knowledge gained from the Cu and Ni effects is applied to explain the recently discovered intermetallic massive spalling, a process that can severely weaken a solder joint. It is pointed out that the massive spalling was caused by the shifting of the equilibrium phase as more and more Cu was extracted out of the solder by the growing intermetallic. Lastly, the problems and opportunities brought on by the cross-interaction of Cu and Ni across a solder joint is presented.