Temperature Compensation Method for Mechanical Base of 3D-Structured Light Scanners

• Published in: Sensors (Basel, Switzerland) Vol. 20; no. 2; p. 362
• Main Authors: Adamczyk, Marcin, Liberadzki, Paweł, Sitnik, Robert
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 08-01-2020; MDPI
• Subjects: 3d imaging; 3d scanner; Calibration; Cultural heritage; Digital cameras; Investigations; Light; Measurement techniques; mechanical base of 3d scanner; Methods; Projectors; Scanners; Simulation; structured light; Temperature; Temperature compensation; temperature effect; Temperature effects; Three dimensional imaging; 3D imaging; 3D scanner; mechanical base of 3D scanner; structured light; temperature effect
• ISSN: 1424-8220; 1424-8220
• DOI: 10.3390/s20020362

The effect of temperature on three-dimensional (3D) structured light scanners is a very complex issue that, under some conditions, can lead to significant deterioration of performed measurements. In this paper, we present the results of several studies concerning the effect of temperature on the mechanical base of 3D-structured light scanners. We also propose a software compensation method suitable for implementation in any existing scanner. The most significant advantage of the described method is the fact that it does not require any specialized artifact or any additional equipment, nor access to the thermal chamber. It uses a simulation of mechanical base thermal deformations and a virtual 3D measurement environment that allows for conducting virtual measurements. The results from the verification experiments show that the developed method can extend the range of temperatures in which 3D-structured light scanners can perform valid measurements by more than six-fold.