Effect of Internal Cooling on Tool-Chip Interface Temperature in Orthogonal Cutting

• Published in: Tribology transactions Vol. 49; no. 2; pp. 125 - 134
• Main Authors: Zhao, H., Barber, G. C., Zou, Q., Gu, R.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Colchester Taylor & Francis Group 01-04-2006; Taylor & Francis; Taylor & Francis Inc
• Subjects: Applied sciences; Cooling; Cutting tools; Exact sciences and technology; Friction, wear, lubrication; Heat; Heat Sink; Internal Cooling; Machine components; Mechanical engineering. Machine design; Orthogonal Cutting; Temperature distribution; Tool-Chip Interface Temperature; Coolant; Modeling; Stationary condition; Heat source; Internal flow; Infinite medium; Orthogonal Cutting; Tool-Chip Interface Temperature; Internal Cooling; Internal variable material; Cutting tool; Orthogonal cutting; Heat sink; Heat transfer; Moving source; Tribology; Chip tool interface
• ISSN: 1040-2004; 1547-397X
• DOI: 10.1080/05698190500544163

A numerical method to study the effect of internal heat sink variables on the tool-chip interface temperature in orthogonal cutting was presented. The analytical method is based on two main assumptions that the chip can be treated as a semi-infinite body with a moving heat source at the tool-chip interface and the tool can be treated as a semi-infinite body with a stationary heat source at the tool-chip interface and a uniform plane heat sink inside the semi-infinite body. An approach using the point heat partition coefficient is employed to obtain the tool-chip interface temperature distribution. The temperature distributions along the tool-chip interface with different heat sink intensities, heat sink distances from the tool-chip interface, and heat sink areas were presented. The effects of the heat sink intensity, heat sink distance from the tool-chip interface, and heat sink area on the tool-chip interface temperature were investigated. It was found that the internal cooling with a heat sink in the cutting tool could greatly affect the tool-chip interface temperature.
Presented at the STLE Annual Meeting in Toronto, Ontario, Canada May 17-20, 2004
Review led by Jane Wang