Potential and Challenges of Diamond Wafer Toward Power Electronics

To achieve a 50% worldwide reduction of CO 2 by the middle of this century, development of energy saving power device technology using wide bandgap materials is urgently needed. Diamond is receiving increasing attention as a next generation material for wide bandgap semiconductors owing to its extre...

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Bibliographic Details
Published in:	International journal of automation technology Vol. 12; no. 2; pp. 175 - 178
Main Author:	Shikata, Shinichi
Format:	Journal Article
Language:	English
Published:	Tokyo Fuji Technology Press Co. Ltd 05-03-2018
Subjects:	Diamond machining Electronics Slicing Surface finishing Wafers Wide bandgap semiconductors
Online Access:	Get full text
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Summary:	To achieve a 50% worldwide reduction of CO 2 by the middle of this century, development of energy saving power device technology using wide bandgap materials is urgently needed. Diamond is receiving increasing attention as a next generation material for wide bandgap semiconductors owing to its extreme characteristics. Research studies investigating large wafers, low resistivity, and low dislocation have accelerated. This study targets the use of wafers for power electronics applications, and the required machining technologies for diamond, including wafer shaping, slicing, and surface finishing, are introduced.
ISSN:	1881-7629 1883-8022
DOI:	10.20965/ijat.2018.p0175