Effect of Ag on Properties, Microstructure, and Thermostability of Cu–Cr Alloy

Cu–Cr-based alloys exhibit excellent electrical conductivity and strength, but their poor thermal stability limits their application in industry. In this paper, Cu–0.2Cr (at. %) and Cu–0.2Cr–0.12Ag (at. %) alloys were prepared to study the effect of Ag on the properties, microstructure, and thermal...

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Bibliographic Details
Published in:	Materials Vol. 13; no. 23; p. 5386
Main Authors:	Sun, Yuqing, Xu, Gaolei, Feng, Xue, Peng, Lijun, Huang, Guojie, Xie, Haofeng, Mi, Xujun, Liu, Xinhua
Format:	Journal Article
Language:	English
Published:	Basel MDPI AG 27-11-2020 MDPI
Subjects:	Aging aging process Alloys Chromium base alloys Cold Cold drawing Continuous casting Copper Copper base alloys Creep strength Cu–Cr system alloy Dislocation density Dislocation mobility Electrical resistivity Industrial applications Mechanical properties Microstructure Morphology Optical microscopes physical properties Precipitates Recrystallization Silver base alloys Softening Thermal stability Beijing China China
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