Effect of Ag on Properties, Microstructure, and Thermostability of Cu–Cr Alloy

• Published in: Materials Vol. 13; no. 23; p. 5386
• Main Authors: Sun, Yuqing, Xu, Gaolei, Feng, Xue, Peng, Lijun, Huang, Guojie, Xie, Haofeng, Mi, Xujun, Liu, Xinhua
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 27-11-2020; MDPI
• Subjects: Aging; aging process; Alloys; Chromium base alloys; Cold; Cold drawing; Continuous casting; Copper; Copper base alloys; Creep strength; Cu–Cr system alloy; Dislocation density; Dislocation mobility; Electrical resistivity; Industrial applications; Mechanical properties; Microstructure; Morphology; Optical microscopes; physical properties; Precipitates; Recrystallization; Silver base alloys; Softening; Thermal stability; Beijing China; China
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma13235386

Cu–Cr-based alloys exhibit excellent electrical conductivity and strength, but their poor thermal stability limits their application in industry. In this paper, Cu–0.2Cr (at. %) and Cu–0.2Cr–0.12Ag (at. %) alloys were prepared to study the effect of Ag on the properties, microstructure, and thermal stability of the Cu–Cr alloy. Microstructure and precipitation were observed by an optical microscope (OM) and a transmission–electron microscope (TEM). After cold-drawing by 99.9% and aging at 450 °C for 2 h, the peak hardness and electric conductivity of the Cu–Cr alloy were 120.3 HV and 99.5% IACS, respectively, and those of the Cu–Cr–Ag alloy were 135.8 HV and 98.3% IACS, respectively. The softening temperature of the Cu–Cr alloy was 500~525 °C, and that of the Cu–Cr–Ag alloy was about 550 °C. The creep strains of the Cu–Cr and Cu–Cr–Ag alloys at 40 MPa and 400 ℃ for 50 h were 0.18% and 0.05%, respectively. Ag elements improved the thermal stability of the Cu–Cr alloy. Recovery and recrystallization occurred before the coarsening of precipitates during the softening process. Ag atoms mainly improved the softening resistance of the alloy by delaying recrystallization, and mainly increased creep resistance by preventing the increase in mobile-dislocation density.