Studies on the Thermal Properties of Epoxy Resins Modified with Two Kinds of Silanes

• Published in: Journal of macromolecular science. Physics Vol. 49; no. 1; pp. 43 - 56
• Main Authors: Ma, Songqi, Liu, Weiqu, Su, Qianqian, Liu, Yunfeng
• Format: Journal Article
• Language: English
• Published: Philadelphia, PA Taylor & Francis Group 01-01-2010; Taylor & Francis
• Subjects: Applied sciences; dehydration polycondensation; Differential scanning calorimetry; Dynamic tests; Epoxy resins; Exact sciences and technology; Inorganic and organomineral polymers; Mechanical analysis; modification; Nuclear magnetic resonance; Physicochemistry of polymers; Preparation; Scanning electron microscopy; Silanes; silicon; Thermal properties; toughness; Solution polycondensation; Property composition relationship; dehydration polycondensation; Epoxy resin; Mechanical properties; Organic silane; Experimental study; modification; Thermal stability; silicon; Dynamic mechanical properties; thermal properties; Morphology; Preparation; epoxy resins; Dimethylsiloxane copolymer; toughness; Siloxane copolymer; Modified material
• ISSN: 0022-2348; 1525-609X
• DOI: 10.1080/00222340903340976

Dimethyldiethoxysilane (DMDES) and diphenyldimethoxysilane (DPDMS)-containing epoxy resins were synthesized by dehydration polycondensation. The chemical structures were determined by FT-IR,
1
H NMR, and
13
C NMR. The cured samples, with 4, 4′-diaminodiphenylmethane (DDM) as curing agent, were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), and tensile and impact testing. Results showed that DMDES and DPDMS-modified epoxy resins possess higher glass transition temperatures, better thermal stability, and better fracture toughness than the neat epoxy resin.