Fabrication of 3-in GaN substrates by hydride vapor phase epitaxy using void-assisted separation method

By using the hydride vapor phase epitaxy and a void-assisted separation method, freestanding 3-in GaN substrates were successfully fabricated for the first time, and the process showed an excellent reproducibility. A thick GaN layer 3.2 in in diameter was easily separated from the base substrate. No...

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Bibliographic Details
Published in:Journal of crystal growth Vol. 310; no. 1; pp. 5 - 7
Main Authors: Yoshida, Takehiro, Oshima, Yuichi, Eri, Takeshi, Ikeda, Ken, Yamamoto, Shunsuke, Watanabe, Kazutoshi, Shibata, Masatomo, Mishima, Tomoyoshi
Format: Journal Article
Language:English
Published: Amsterdam Elsevier B.V 04-01-2008
Elsevier
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Summary:By using the hydride vapor phase epitaxy and a void-assisted separation method, freestanding 3-in GaN substrates were successfully fabricated for the first time, and the process showed an excellent reproducibility. A thick GaN layer 3.2 in in diameter was easily separated from the base substrate. No cracks were generated during the separation process. The dislocation density was of the order of 10 6 cm –2. The carrier density was approximately 1×10 18 cm –3 and the mobility was 3.4×10 2 cm 2 V –1 s –1. The concentrations of impurities, estimated by secondary-ion mass spectrometry, were below the limit of detection, except for Si. The Si concentration was approximately 1×10 18 cm –3, which is in good agreement with the carrier density.
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content type line 23
ISSN:0022-0248
1873-5002
DOI:10.1016/j.jcrysgro.2007.10.014