High temperature diffusion induced liquid phase joining of a heat resistant alloy

• Published in: Journal of alloys and compounds Vol. 460; no. 1; pp. 379 - 385
• Main Authors: Wikstrom, N.P., Egbewande, A.T., Ojo, O.A.
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 28-07-2008; Elsevier
• Subjects: Applied sciences; Exact sciences and technology; High temperature alloys; Joining, thermal cutting: metallurgical aspects; Metals; Metals. Metallurgy; Welding; Metals; High temperature alloys; Nickel base alloys; Scanning electron microscopy; Waspaloy; Solubility; Fusion welding; Dispersive spectrometry; Diffusivity; Solidification; Superalloy; Energy gap; Transient liquid phase bonding; Solidification rate; Holding time; Microstructure
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2007.06.066

Transient liquid phase bonding (TLP) of a nickel base superalloy, Waspaloy, was performed to study the influence of holding time and temperature on the joint microstructure. Insufficient holding time for complete isothermal solidification of liquated insert caused formation of eutectic-type microconstituent along the joint centerline region in the alloy. In agreement with prediction by conventional TLP diffusion models, an increase in bonding temperature for a constant gap size, resulted in decrease in the time,
t
f, required to form a eutectic-free joint by complete isothermal solidification. However, a significant deviation from these models was observed in specimens bonded at and above 1175
°C. A reduction in isothermal solidification rate with increased temperature was observed in these specimens, such that a eutectic-free joint could not be achieved by holding for a time period that produced complete isothermal solidification at lower temperatures. Boron-rich particles were observed within the eutectic that formed in the joints prepared at the higher temperatures. An overriding effect of decrease in boron solubility relative to increase in its diffusivity with increase in temperature, is a plausible important factor responsible for the reduction in isothermal solidification rate at the higher bonding temperatures.