Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

• Published in: Journal of materials science & technology Vol. 27; no. 8; pp. 741 - 745
• Main Authors: Kang, T.Y., Xiu, Y.Y., Hui, L., Wang, J.J., Tong, W.P., Liu, C.Z.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01-08-2011
• Subjects: Alloys; Copper; IMC; Interfacial reaction; Intermetallic compounds; Intermetallics; Kinetics; Lead free; Microelectronics; Solder; Solders; Tin; 微电子; 无铅焊锡; 焊料合金; 生长动力学; 生长过程; 金属间化合物; 铜互连; Solder; Intermetallics; Interfacial reaction; Kinetics
• ISSN: 1005-0302; 1941-1162
• DOI: 10.1016/s1005-0302(11)60136-9

The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.