Effect of surfactants on the electrodeposition of Cu-TiO2 composite coatings prepared by jet electrodeposition

• Published in: Journal of alloys and compounds Vol. 777; pp. 1245 - 1250
• Main Authors: Ning, Dongdong, Zhang, Ao, Murtaza, Muhammad, Wu, Hui
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 10-03-2019
• Subjects: Jet electrodeposition; Surfactant; Jet electrodeposition; Surfactant
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2018.11.077

The influences of anionic surfactant SDS (sodium dodecylsulfate) and cationic surfactant CTAB (hexadecyl trimethyl ammonium bromide) on electrodeposition of Cu-TiO2 composite coatings by jet electrodeposition were studied. The maximum TiO2 content in the composite coatings was 8.94 wt % at optimum concentration of 50 mg/L for SDS and the maximum TiO2 content was 11.45 wt % at optimum concentration of 30 mg/L for CTAB, while the maximum TiO2 content was 7.25 wt% without any surfactant. The coatings deposited with either SDS or CTAB became more homogeneous. XRD analysis showed that both SDS and CTAB decreased the grain sizes of deposited coatings. The preferred orientations for composite coatings with SDS and CTAB were (111) plane and (220) plane respectively. With optimum addition of SDS (50 mg/L) and CTAB (30 mg/L) in the electrolyte, both hardness and wear resistant of the composite coatings was obviously enhanced due to second phase strengthening and grain refinement strengthening.
•Cu-TiO2 composite coatings were prepared by Jet electrodeposition.•SDS can slightly increase TiO2 content.•CTAB can significantly increase TiO2 content.•The maximum TiO2 content was 11.45 wt% when optimum CTAB was added.•With high TiO2 content, the composite coatings show enhanced wear performance.