Moisture resistance of SU-8 and KMPR as structural material

• Published in: Microelectronic engineering Vol. 86; no. 4; pp. 765 - 768
• Main Authors: Blanco Carballo, V.M., Melai, J., Salm, C., Schmitz, J.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 01-04-2009; Elsevier
• Subjects: Adhesion strength; Applied sciences; CMOS post-processing; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; General equipment and techniques; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; KMPR; Microelectronic fabrication (materials and surfaces technology); Moisture; Optoelectronic devices; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing; SU-8; CMOS post-processing; SU-8; Moisture; KMPR; Adhesion strength; Shear test; Micromachine; Adhesion; Radiation detector; Microelectronic fabrication; Complementary MOS technology; Imaging; Humidity resistance; Resist; Photolithography; Photoresist
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2008.12.076

This paper treats the moisture resistance of SU-8 and KMPR, two photoresists considered as structural material in microsystems. Our experiments focus on the moisture resistance of newly developed radiation imaging detectors containing these resists. Since these microsystems will be used unpackaged, they are susceptible to all kinds of environmental conditions. Already after 1 day of exposure to a humid condition the structural integrity and adhesion of SU-8 structures, measured by a shear test is drastically reduced. KMPR photoresist shows much stronger moisture resistance properties, making it a suitable alternative in our application.