Depletion-isolation effect in vertical MOSFETs during the transition from partial to fully depleted operation

• Published in: IEEE transactions on electron devices Vol. 53; no. 4; pp. 929 - 932
• Main Authors: Hakim, M.M.A., de Groot, C.H., Gili, E., Uchino, T., Hall, S., Ashburn, P.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01-04-2006; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Bias; Depletion; Depletion isolation; Drains; Electronics; Exact sciences and technology; fully depleted (FD); Isolation technology; Merging; MOSFETs; partially depleted (PD); Pillars; Reduction; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Simulation; Studies; Transistors; vertical MOSFETs (VMOS); MOSFET; partially depleted (PD); fully depleted (FD); Drain current; vertical MOSFETs (VMOS); Impact ionization; Vertical transistor; Depletion isolation; Floating body
• ISSN: 0018-9383; 1557-9646
• DOI: 10.1109/TED.2006.871182

A simulation study is made of floating-body effects (FBEs) in vertical MOSFETs due to depletion isolation as the pillar thickness is reduced from 200 to 10nm. For pillar thicknesses between 200-60nm, the output characteristics with and without impact ionization are identical at a low drain bias and then diverge at a high drain bias. The critical drain bias V/sub dc/ for which the increased drain-current is observed is found to decrease with a reduction in pillar thickness. This is explained by the onset of FBEs at progressively lower values of the drain bias due to the merging of the drain depletion regions at the bottom of the pillar (depletion isolation). For pillar thicknesses between 60-10nm, the output characteristics show the opposite behavior, namely, the critical drain bias increases with a reduction in pillar thickness. This is explained by a reduction in the severity of the FBEs due to the drain debiasing effect caused by the elevated body potential. Both depletion isolation and gate-gate coupling contribute to the drain-current for pillar thicknesses between 100-40nm.