Experiments and Numerical Simulations on Local Degradation Characteristics of Coated Conductor Due to Overcurrent
Coated conductors are subjected to short-circuit currents 10 to 30 times greater than the operating current in the use of superconducting power cables. The I c and thickness of the stabilizer are considered to be nonuniformly distributed in the real manufacturing process. Thus, the coated conductor...
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Published in: | IEEE transactions on applied superconductivity Vol. 23; no. 3; p. 8002205 |
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Main Authors: | , , , , , |
Format: | Journal Article Conference Proceeding |
Language: | English |
Published: |
New York, NY
IEEE
01-06-2013
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
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Summary: | Coated conductors are subjected to short-circuit currents 10 to 30 times greater than the operating current in the use of superconducting power cables. The I c and thickness of the stabilizer are considered to be nonuniformly distributed in the real manufacturing process. Thus, the coated conductor may be damaged locally by the hot spot due to the overcurrent. Therefore, it is important to clarify the local degradation characteristics of the coated conductor and determine its tolerance against the fault current in the actual operation. In a previous study, overcurrent experiments and numerical simulations on thermal stress-strain were carried out on a coated conductor with a nonuniformly distributed I c . In this study, two samples with nonuniformly distributed copper plating thickness were tested. Numerical simulations based on the finite element method were performed to simulate the temperature and thermal stress-strain distribution caused by the overcurrent. The nonuniform thickness of the copper plating and the longitudinal length of the nonuniform area were considered as the simulation parameters. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 1051-8223 1558-2515 |
DOI: | 10.1109/TASC.2013.2238592 |