Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

• Published in: Journal of materials science Vol. 50; no. 20; pp. 6748 - 6756
• Main Authors: Bashir, M. Nasir, Haseeb, A. S. M. A, Rahman, Abu Zayed Mohammad Saliqur, Fazal, M. A, Kao, C. R
• Format: Journal Article
• Language: English
• Published: New York Springer US 01-10-2015; Springer; Springer Nature B.V
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Classical Mechanics; Copper; Crystallography and Scattering Methods; Current density; density; doping; electrical resistance; electrodes; Electromigration; Flux; growth rate; Intermetallic compounds; Materials Science; mixing; Nanoparticles; Nickel; Original Paper; Polymer Sciences; Soldered joints; Solders; Solid Mechanics; Substrates; Tin base alloys; Solder Joint; Solder Ball; Solder Matrix; Cathode Side; Anode Side
• ISSN: 0022-2461; 1573-4803
• DOI: 10.1007/s10853-015-9230-7

The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 × 10⁴ A/cm², at 80 ± 3 °C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.