Effective modulus of polycrystalline aggregates in different geometrical configurations

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 527; no. 18-19; pp. 5008 - 5017
• Main Authors: Fan, H., Xie, X.M., Sze, K.Y.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 15-07-2010; Elsevier
• Subjects: Aggregates; Computer simulation; Condensed matter: structure, mechanical and thermal properties; Effective modulus; Estimates; Exact sciences and technology; Finite element analysis; Finite element method; Materials science; Mathematical analysis; Mechanical and acoustical properties; Physical properties of thin films, nonelectronic; Physics; Polycrystalline material; Spreads; Statistics; Structural materials; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film; Thin films; Effective modulus; Finite element analysis; Polycrystalline material; Statistics; Thin film; Elastic constants; Polycrystals; Metal clusters; Random distribution; Thin films; Thickness; Young modulus; Finite element method; Transition elements; Analytical method; Free-standing film; Stiffness; Copper
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2010.04.054

In the present study, a finite element scheme with random distribution strategy is employed to systematically investigate the modulus difference of polycrystalline copper aggregates in different geometrical configurations (three-dimensional bulk and thin film configurations). Firstly, the finite element simulation is performed to estimate the effective elastic constants in three-dimensional bulk configuration. The numerical estimations are in good agreement with the existing analytical solutions and experimental measurements. Secondly, the proven finite element scheme is extended to the prediction of the effective moduli of the free-standing and substrate-attached thin films. For the free-standing thin film, the effective Young's modulus decreases with reducing the film thickness. For the substrate-attached thin film, its effective modulus is affected by the relative stiffness between the substrate and the film. The spread of the effective moduli in different configurations could be as large as 20%.