Suspended membranes, cantilevers and beams using SU-8 foils

• Published in: Microelectronic engineering Vol. 87; no. 5; pp. 1274 - 1277
• Main Authors: Melai, J., Blanco Carballo, V.M., Salm, C., Schmitz, J.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 01-05-2010; Elsevier
• Subjects: Applied sciences; Beams (radiation); Cantilever; Cantilever beams; Cavity; Channel; Channels; CMOS; Cross-disciplinary physics: materials science; rheology; Design. Technologies. Operation analysis. Testing; Electrodes; Electronics; Exact sciences and technology; Foil; Foils (structural shapes); Holes; Integrated circuits; Materials science; MEMS; Micro- and nanoelectromechanical devices (mems/nems); Microelectronic fabrication (materials and surfaces technology); Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; SU-8; Surface treatments; Surface-micromachining; Topography; Wafer post-processing; CMOS; Cavity; Channel; Wafer post-processing; MEMS; SU-8; Cantilever; Foil; Surface-micromachining; Suspended structure; Material processing; Stacking; Cantilever beam; Microelectronic fabrication; Complementary MOS technology; Topography; Photolithography; Cost lowering; Microelectromechanical device; Wafer; Photoresist; Patterning; Stacking sequence; Micromachining; Light sensitive polymer; High voltage
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2009.10.035

This paper presents a fast, easy and low-cost method to create suspended structures using SU-8 photoresist. The method consists of laminating SU-8 foils on top of previously defined topographies, followed by SU-8 foil patterning. This surface-micromachining approach has been successfully employed to fabricate a variety of structures, including high-voltage electrodes over CMOS chips, stacked vias, closed cavities, channels, cantilevers and double-clamped beams.