Development of high-strength, good-conductivity Cu/Ti bulk nano-layered composites by a combined roll-bonding process

• Published in: Journal of alloys and compounds Vol. 701; pp. 127 - 130
• Main Authors: Hosseini, M., Danesh Manesh, H., Eizadjou, M.
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 15-04-2017; Elsevier BV
• Subjects: Annealing; Bimetal composite; Bonding strength; Composite materials; Conductivity; Copper; Electrical resistivity; Formability; Laminates; Multilayers; Nanolamellar structure; Roll bonding; Titanium; Nanolamellar structure; Bimetal composite; Roll-bonding
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2017.01.048

Bulk nano-layered Cu/Ti composites were produced by combining continual annealing and roll-bonding (CAR) as well as accumulative roll-bonding (ARB). This technique was used to improve the material formability, thereby enhancing the maximum attainable processing cycle. The formation of the nano-laminated structure with semi-continuous Ti layers within the Cu matrix was confirmed via the microscopic observation. The properties evaluation of the composites showed the fabrication of a high-strength material with proper electrical conductivity.
•Cu/Ti nanolamellar composites can be produced by a combined roll-bonding method.•A significant increment in the tensile strength of the material is achieved.•Despite the tensile strength, the electrical resistivity enhancement is minor.