Physical parameters affecting deposition rates of binary alloys in a magnetron sputtering system

• Published in: Vacuum Vol. 49; no. 2; pp. 153 - 160
• Main Authors: Habib, SK, Rizk, A, Mousa, IA
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 01-02-1998; Elsevier
• Subjects: Applied sciences; Cross-disciplinary physics: materials science; rheology; Deposition by sputtering; Exact sciences and technology; Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Operating mode; Copper base alloys; Crystal growth from vapors; XRD; Experimental study; Thin films; Binary alloys; Tin alloys; Magnetrons; Cathode sputtering; Physical parameter; Kinetics; Silver alloys; Transition element alloys
• ISSN: 0042-207X; 1879-2715
• DOI: 10.1016/S0042-207X(97)00158-9

A study was made of the physical parameters affecting the deposition rates of thin films sputtered from binary targets of Cu-6 wt% Ag and Cu-10 wt% Sn in a d.c. magnetron sputtering system. It was observed that the deposition rates of thin films sputtered from the CuAg target were generally greater than those from the CuSn target, but mixing oxygen with the argon gas during sputtering increased rates for sputtering from both targets, separately to twice that for nitrogen mixed with argon. The deposition rates were determined as a function of gas pressure, power input and transit distance between target used and substrate holder. Xray analysis of both targets and deposited films were made and the results presented.