Numerical modeling of interconnect flow channel design and thermal stress analysis of a planar anode-supported solid oxide fuel cell stack

• Published in: Energy (Oxford) Vol. 69; pp. 553 - 561
• Main Authors: Wei, S.-S., Wang, T.-H., Wu, J.-S.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01-05-2014; Elsevier
• Subjects: Applied sciences; CFD; Channels; Current density; Density; Design engineering; Energy; Energy. Thermal use of fuels; Equipments for energy generation and conversion: thermal, electrical, mechanical energy, etc; Exact sciences and technology; Fuel cells; interconnect; Mathematical models; SOFC; Solid oxide fuel cells; stack; Stacks; thermal stress; Thermal stresses; CFD; stack; thermal stress; interconnect; SOFC; Thermal stress; Numerical simulation; Modeling; Solid oxide fuel cell; Fuel cell
• ISSN: 0360-5442
• DOI: 10.1016/j.energy.2014.03.052

In this paper, we propose a new design of flow channel and stack arrangement based on the numerical study considering the effect of the flow channel design on the stack performance and analyze the thermal stress of a planar anode-supported solid oxide fuel cell stack. We also attempt to simplify the cell stack design without affecting its performance and propose an easier sealing method of cell stacks through the study of the thermal stress distribution. The results indicate that the new design, created by changing the cathode flow channel to a porous current collector, with a 6.3% increase in power density, an 8.6% increase in electrical efficiency. Both more uniform flow and current density distribution can be obtained as compared with a conventional counter-flow design. In addition, we propose a new design direction of cell stack, which could be simpler and easier to fabricate, in which material can easily undertake the resulting stress based on the thermal stress analysis.
•Propose an optimized design of current collector in a planar anode-support SOFC.•Propose a very simple stack design that can produce very uniform flow distribution.•Propose a new stack design with lower stress distribution with cheaper material.