Residual carbon and carrier concentration in InGaP layers grown by chemical beam epitaxy

In this work we present a study on the carbon incorporation in InGaP layers grown by Chemical Beam Epitaxy as a function of growth temperature. Hall measurements show that the electron concentration increased from 2.3×10 14 to 8.9×10 16 cm −3 as the growth temperature increased from 500 °C to 560 °C...

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Bibliographic Details
Published in:Thin solid films Vol. 429; no. 1; pp. 91 - 95
Main Authors: Bettini, J., de Carvalho, M.M.G., Pudenzi, M.A.A., Laureto, E., Meneses, E.A.
Format: Journal Article
Language:English
Published: Lausanne Elsevier B.V 01-04-2003
Elsevier Science
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Summary:In this work we present a study on the carbon incorporation in InGaP layers grown by Chemical Beam Epitaxy as a function of growth temperature. Hall measurements show that the electron concentration increased from 2.3×10 14 to 8.9×10 16 cm −3 as the growth temperature increased from 500 °C to 560 °C. Lower growth temperature InGaP layers are more resistive. Using photoluminescence and a carbon-implanted sample, we identify an acceptor level at nearly 45 meV from the top of the valence band. Part of incorporated carbon acts as an acceptor and part as a donor. The electrical and photoluminescence measurements show that the ratio between acceptors and donors increase as the growth temperature decreases. Due to this compensation, samples grown at lower temperatures (500 °C) present a resistively 10 4 times higher than those grown at high temperature (560 °C).
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content type line 23
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(03)00060-9