Residual carbon and carrier concentration in InGaP layers grown by chemical beam epitaxy
In this work we present a study on the carbon incorporation in InGaP layers grown by Chemical Beam Epitaxy as a function of growth temperature. Hall measurements show that the electron concentration increased from 2.3×10 14 to 8.9×10 16 cm −3 as the growth temperature increased from 500 °C to 560 °C...
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Published in: | Thin solid films Vol. 429; no. 1; pp. 91 - 95 |
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Main Authors: | , , , , |
Format: | Journal Article |
Language: | English |
Published: |
Lausanne
Elsevier B.V
01-04-2003
Elsevier Science |
Subjects: | |
Online Access: | Get full text |
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Summary: | In this work we present a study on the carbon incorporation in InGaP layers grown by Chemical Beam Epitaxy as a function of growth temperature. Hall measurements show that the electron concentration increased from 2.3×10
14 to 8.9×10
16 cm
−3 as the growth temperature increased from 500 °C to 560 °C. Lower growth temperature InGaP layers are more resistive. Using photoluminescence and a carbon-implanted sample, we identify an acceptor level at nearly 45 meV from the top of the valence band. Part of incorporated carbon acts as an acceptor and part as a donor. The electrical and photoluminescence measurements show that the ratio between acceptors and donors increase as the growth temperature decreases. Due to this compensation, samples grown at lower temperatures (500 °C) present a resistively 10
4 times higher than those grown at high temperature (560 °C). |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/S0040-6090(03)00060-9 |