Formation of epitaxial erbium–silicide islands on Si(0 0 1)

Erbium films of 0.5, 2 and 6 nm thickness were evaporated in UHV onto Si(0 0 1) substrates, annealed and characterized in situ by reflected high-energy-electron diffraction (RHEED). The RHEED pattern was streaky for ErSi 2− x films at all thicknesses were formed at 400 °C. A heat treatment of the 0....

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Bibliographic Details
Published in:Surface science Vol. 578; no. 1; pp. 142 - 148
Main Authors: Pető, G., Molnár, G., Horváth, Z.E., Daróczi, Cs.S., Zsoldos, É., Gyulai, J.
Format: Journal Article
Language:English
Published: Lausanne Elsevier B.V 10-03-2005
Amsterdam Elsevier Science
New York, NY
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Summary:Erbium films of 0.5, 2 and 6 nm thickness were evaporated in UHV onto Si(0 0 1) substrates, annealed and characterized in situ by reflected high-energy-electron diffraction (RHEED). The RHEED pattern was streaky for ErSi 2− x films at all thicknesses were formed at 400 °C. A heat treatment of the 0.5 and 2 nm thick Er films at 800 °C induced an inhomogeneous surface showing RHEED patterns both of the Si(0 0 1) substrate and the epitaxial ErSi 2− x . The same effect was observed after successive repetition of Er depositions, 12 times for the 0.5 nm and three times for the 2 nm thick Er films. In contrast for a 6 nm Er layer the RHEED pattern remained unchanged after the heat treatment at 800 °C. Atomic force microscopy (AFM) indicated the formation of a quasi-continuous layer with roughness independent of the Er film thickness. Cross-sectional transmission electron microscopy (XTEM) showed structures with a “hut like” form. This “continuous–discontinuous” like transformation of the epitaxial ErSi 2− x film cannot be explained by only the well known strain effect.
ISSN:0039-6028
1879-2758
DOI:10.1016/j.susc.2005.01.027