Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

• Published in: IEEE transactions on electron devices Vol. 61; no. 7; pp. 2584 - 2587
• Main Authors: Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang
• Format: Journal Article
• Language: English
• Published: New York IEEE 01-07-2014; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: 3-D integrated circuit (3-D IC); Boards; Chains; Chips; CMOS; Current measurement; Educational institutions; Electrical resistance measurement; Integrated circuits; location; open; parallel resistor chain; Printed circuits; Resistance; Resistors; Three dimensional; through silicon via (TSV); Through-silicon vias; parallel resistor chain; location; through silicon via (TSV); open; 3-D integrated circuit (3-D IC)
• ISSN: 0018-9383; 1557-9646
• DOI: 10.1109/TED.2014.2321453

This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only.