FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

• Published in: AIP advances Vol. 7; no. 3; pp. 035102 - 035102-9
• Main Authors: Denu, Garuma Abdisa, Mirani, Jibran Hussain, Fu, Jiao, Liu, Zongchen, Wang, Hongxing
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 01-03-2017; AIP Publishing LLC
• Subjects: Cooling effects; Copper; Diamond films; Diamonds; Electronic components; Film thickness; Finite element method; Interfacial stresses; Interlayers; Mathematical models; Product design; Reduction; Silicon carbide; Spreaders; Thermal analysis; Thermal stress
• ISSN: 2158-3226; 2158-3226
• DOI: 10.1063/1.4978043

The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.