Microstructure control and its observation of rapid solidification Cu–La alloy for the development of fluoride-ion batteries

• Published in: Journal of alloys and compounds Vol. 930; p. 167447
• Main Authors: Zhu, S., Akamine, H., Nagahata, Y., Tojigamori, T., Miki, H., Zhang, Y., Tokunaga, T., Iikubo, S.
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 05-01-2023; Elsevier BV
• Subjects: Cooling rate; Copper base alloys; Cu–La alloy; Electrode; Fluoride-ion batteries; Materials selection; Microstructure; Nano and microstructure; Rapid solidification; Rapid solidification method; Rotation; Electrode; Cu–La alloy; Rapid solidification method; Nano and microstructure; Fluoride-ion batteries
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2022.167447

We report on the microstructure of Cu-La alloys, which is a candidate material for the electrode of fluoride-ion battery, prepared by the rapid solidification method. The Cu-La alloys near eutectic point (24.5at%La) were quenched at different cooling speed to obtain optimized lamellar microstructure. The cross-section of the Cu-24.5at%La alloy exhibited a lamellar microstructure, in which the Cu-rich and La-rich phases were well proportioned. A hexagonal Cu5La phase with a space group P6/mmm was confirmed in the Cu-enriched areas, along with tetragonal Cu4La particles with an I4̅m2 and hexagonal Cu2La with the P6/mmm. Furthermore, different cooling rate during solidification were applied by changing the wheel rotation speed of the device. The higher the rotation speed, the faster the cooling rate, and the finer the microstructure. The width of each layer in the microstructure was approximately 100 nm.
•Systematic investigation on the microstructure of the Cu-24.5at%La alloy exhibited a lamellar microstructure, in which the Cu-enriched and La-enriched phases were well proportioned.•A hexagonal Cu5La phase was confirmed in the Cu-enriched areas, along with tetragonal Cu4La particles and hexagonal Cu2La particles.•Different cooling rate during solidification were applied. The faster the cooling rate, the finer the microstructure. The width of each layer in the microstructure was approximately 100 nm.