A Novel Process for the Manufacture of Ceramic Microelectrodes for Biomedical Applications

A novel process, based on microextrusion of preceramic polymers, was developed for manufacturing ceramic microelectrodes, mainly for biomedical applications. A coextrusion approach was used to obtain filaments with inner conductive lines after proper doping. Chemical reticulation and high‐temperatur...

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Bibliographic Details
Published in:International journal of applied ceramic technology Vol. 5; no. 1; pp. 37 - 43
Main Authors: Perale, Giuseppe, Giordano, Carmen, Daniele, Francesco, Masi, Maurizio, Colombo, Paolo, Gottardo, Laura, Maccagnan, Simone
Format: Journal Article
Language:English
Published: Malden, USA Blackwell Publishing Inc 01-01-2008
Online Access:Get full text
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Summary:A novel process, based on microextrusion of preceramic polymers, was developed for manufacturing ceramic microelectrodes, mainly for biomedical applications. A coextrusion approach was used to obtain filaments with inner conductive lines after proper doping. Chemical reticulation and high‐temperature pyrolysis were applied to convert the meltable preceramic, polymeric resins into SiOC ceramic materials. Different cross‐sectional geometries were produced. The flexural strength of filaments depended on the outer diameter size; doping produced filaments with an average conductivity of ∼0.4 1/Ω cm for a 50 wt% carbon black load. The results on L929 and MG63 cell line models indicated good biological performance of Si–O–C ceramics and confirmed citocompatibility.
Bibliography:ark:/67375/WNG-WXCKJC67-L
istex:4A9A427631FBD7BE5545BBBB50F79AB7FA9608A8
ArticleID:IJAC02186
This effort was partially sponsored by the Air Force Office of Scientific Research, Air Force Material Command, USAF, under grant number FA8655‐04‐1‐3055 (2004). The U.S. Government is authorized to reproduce and distribute reprints for Government purpose notwithstanding any copyright notation thereon.
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giuseppe.perale@polimi.it
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SourceType-Scholarly Journals-1
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ISSN:1546-542X
1744-7402
DOI:10.1111/j.1744-7402.2008.02186.x