Thermal expansion of a novel hybrid SiC foam–SiC particles–Al composites

• Published in: Composites science and technology Vol. 67; no. 15; pp. 3404 - 3408
• Main Authors: Zhao, L.Z., Zhao, M.J., Cao, X.M., Tian, C., Hu, W.P., Zhang, J.S.
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 01-12-2007; Elsevier
• Subjects: Applied sciences; Dispersion hardening metals; Exact sciences and technology; Hybrid reinforcement; Interpenetrating; Metal-matrix composites; Metals. Metallurgy; Powder metallurgy. Composite materials; Production techniques; Technology; Thermal expansion; Metal-matrix composites; Thermal expansion; Interpenetrating; Hybrid reinforcement; Silicon carbide; Metal foam; Expansion; Composite material; Dispersion strengthened metal
• ISSN: 0266-3538; 1879-1050
• DOI: 10.1016/j.compscitech.2007.03.020

A new type of hybrid SiC foam–SiC particles–Al composites (
V
SiC
=
53, 56.2 and 59.9%) to be used as an electronic packaging substrate material were fabricated by squeeze casting technique, and their thermal expansion behavior was evaluated. The coefficients of thermal expansion (CTEs) of the hybrid composites in the range of 20–100
°C were found to be between 6.6 and 7.7
ppm/°C. The measured CTEs are much lower than those of SiC particle-reinforced aluminum (SiC
p–Al) composites with the same content of SiC because of the characteristic interpenetrating structure of the hybrid composites. A material of such a low CTE is ideal for electronic packaging because of the low thermal mismatch (and therefore, low thermal stresses) between the electronic component and the substrate. To achieve similar CTEs in SiC
p–Al composites, the volume fraction of SiC would be much higher than that in the hybrid composites.