Progress in Microelectromechanical Systems

• Published in: Strain Vol. 43; no. 1; pp. 13 - 25
• Main Author: Pryputniewicz, R J (Rich)
• Format: Journal Article
• Language: English
• Published: Oxford, UK Blackwell Publishing Ltd 01-02-2007
• Subjects: ACES methodology; adverse conditions; computational analysis/simulation; education; full field-of-view; high operational speeds; low power; materials; MEMS systems; nanometer accuracy; NDT; packaging; specific applications; test/characterisation
• ISSN: 0039-2103; 1475-1305
• DOI: 10.1111/j.1475-1305.2007.00303.x

:  Recent advances in microelectromechanical systems (MEMS) technology have led to the development of a multitude of new devices heretofore impossible. However, applications of these devices are still hampered by challenges posed by their integration and packaging. The current trend in micro/nanosystems is to produce ever smaller, lighter and more capable devices at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while ensuring durable and reliable performance. Some of the new devices have been developed to function at high operational speeds, and others to make accurate measurements of operating conditions of specific processes. Regardless of their applications, the devices have to be packaged to facilitate their use. MEMS packaging, however, is application‐specific and, usually, has to be developed on a case‐by‐case basis. To facilitate advances of MEMS, educational programmes have been introduced addressing all aspects in their development. This paper addresses progress in MEMS by presenting pertinent aspects in a development of MEMS including, but not limited to, design, analysis, fabrication, characterisation, packaging, and testing. This presentation is illustrated with selected examples.