Cooling flow regime of a plasma thermal quench
Abstract A large class of Laboratory, Space, and Astrophysical plasmas is nearly collisionless. When a localized energy or particle sink, for example, in the form of a radiative cooling spot or a black hole, is introduced into such a plasma, it can trigger a plasma thermal collapse, also known as a...
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Published in: | Europhysics letters Vol. 141; no. 5; pp. 54002 - 54008 |
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Main Authors: | , , |
Format: | Journal Article |
Language: | English |
Published: |
Les Ulis
EDP Sciences, IOP Publishing and Società Italiana di Fisica
01-03-2023
IOP Publishing |
Subjects: | |
Online Access: | Get full text |
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Summary: | Abstract
A large class of Laboratory, Space, and Astrophysical plasmas is nearly collisionless. When a localized energy or particle sink, for example, in the form of a radiative cooling spot or a black hole, is introduced into such a plasma, it can trigger a plasma thermal collapse, also known as a thermal quench in tokamak fusion. Here we show that the electron thermal conduction in such a nearly collisionless plasma follows the convective energy transport scaling in itself or in its spatial gradient, due to the constraint of ambipolar transport. As a result, a robust cooling flow aggregates mass toward the cooling spot and the thermal collapse of the surrounding plasma takes the form of four propagating fronts that originate from the radiative cooling spot, along the magnetic field line in a magnetized plasma. The slowest one, which is responsible for deep cooling, is a shock front. |
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Bibliography: | USDOE Office of Science (SC), Advanced Scientific Computing Research (ASCR). Scientific Discovery through Advanced Computing (SciDAC) LA-UR-22-24503 USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division USDOE Office of Science (SC), Fusion Energy Sciences (FES) USDOE Laboratory Directed Research and Development (LDRD) Program 89233218CNA000001; AC02-05CH11231 USDOE National Nuclear Security Administration (NNSA) |
ISSN: | 0295-5075 1286-4854 |
DOI: | 10.1209/0295-5075/acbb20 |