New two-step growth of microcrystalline silicon thin films without incubation layer
A new two-step growth method was proposed to fabricate microcrystalline silicon (μc-Si:H) thin films by an electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD). An ultra thin Si film was first deposited and followed by H 2 plasma treatment for few minutes, and then the...
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Published in: | Journal of crystal growth Vol. 322; no. 1; pp. 1 - 5 |
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Main Authors: | , , , |
Format: | Journal Article |
Language: | English |
Published: |
Amsterdam
Elsevier B.V
01-05-2011
Elsevier |
Subjects: | |
Online Access: | Get full text |
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Summary: | A new two-step growth method was proposed to fabricate microcrystalline silicon (μc-Si:H) thin films by an electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD). An ultra thin Si film was first deposited and followed by H
2 plasma treatment for few minutes, and then the μc-Si:H film was deposited on it. High-resolution transmission electron microscope (HRTEM) and Raman spectrometer were used to study the microstructures and the crystalline volume fraction of μc-Si:H films. The HRTEM results show that the amorphous silicon thin film with a thickness of 15
nm can be crystallized by H
2 plasma treatment in 2
min, and then it serves as the seed layer for the subsequent growth of μc-Si:H films. By optimizing the deposition parameters, the μc-Si:H film without amorphous incubation layer can be fabricated by this new two-step method and a proper crystalline volume fraction of 50.6% can be obtained. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0022-0248 1873-5002 |
DOI: | 10.1016/j.jcrysgro.2011.03.006 |