Plasma Processing of Functional Thin Films by Sputtering Deposition Using Metal-Based Powder Target

• Published in: Japanese Journal of Applied Physics Vol. 52; no. 11; pp. 11NB07 - 11NB07-4
• Main Authors: Kawasaki, Hiroharu, Ohshima, Tamiko, Ihara, Takeshi, Arafune, Kento, Taniyama, Daichi, Yagyu, Yoshihito, Suda, Yoshiaki
• Format: Journal Article
• Language: English
• Published: The Japan Society of Applied Physics 01-11-2013
• Subjects: Deposition; Electron density; Plasma (physics); Sputtering; Thin films; Titanium; Titanium dioxide; X-rays
• ISSN: 0021-4922; 1347-4065
• DOI: 10.7567/JJAP.52.11NB07

Titanium-based functional thin films were prepared by a sputtering deposition method using a metal powder target, and the electron density and temperature of the processing plasma were investigated. The electron density of the plasma, measured by a probe method, when using a powder target was higher than that when using a bulk target. The deposition rate when using a powder target was also higher than that in the case of a bulk target. These results may be due to the net-cathode area of the powder target being larger than that of the bulk target. X-ray photoelectron spectroscopy, X-ray diffraction measurements, and atomic force microscopy images of the films prepared using the Ti powder target indicated nearly the same properties as those of films prepared using a Ti bulk target, and the prepared films are oxide. These results suggest that TiO 2 thin films can be prepared using a Ti powder target and that the quality is almost the same as those of films prepared using a Ti bulk target.