Automatic generation of accurate circuit models of 3-D interconnect

• Published in: IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging Vol. 21; no. 3; pp. 225 - 240
• Main Authors: Kamon, M., Marques, N.A., Silveira, L.M., White, J.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01-08-1998; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Computer aided design; Computer science; control theory; systems; Conductors; Design optimization; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuit interconnections; Integrated circuits; Iterative algorithms; Iterative methods; Jacobian matrices; Packaging; Reduced order systems; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Software; Solid modeling; Voltage; Software tool; Three dimensional structure; Electromagnetic interference; Interconnection; Electronic packaging; Integrated circuit; High speed; Automatic generation; Maxwell equation; Modeling; Optimization
• ISSN: 1070-9894; 1558-3686
• DOI: 10.1109/96.704933

In order to optimize high-speed systems, designers need tools that automatically generate reduced order SPICE compatible models from geometric descriptions of interconnect and packaging. In this paper, we consider structures small compared to a wavelength, and use a discretized integral formulation combined with an Arnoldi-based model-order reduction strategy to compute efficiently accurate reduced-order models from three-dimensional (3-D) structures. Several issues are addressed including: (1) formulation to insure passivity in the reduced-order models; (2) efficient reduction using preconditioned inner-loop iterative methods; (3) expansion about multiple s-domain points. Results are presented on several industrial examples to demonstrate the capabilities and speed of these new methods.