Synthesis and characterization of fluorinated poly(amide imide)s derived from 1,4-bis(2′-trifluoromethyl-4′-trimellitimidophenoxy)benzene and aromatic diamines

• Published in: Journal of polymer science. Part A, Polymer chemistry Vol. 41; no. 12; pp. 1831 - 1840
• Main Authors: Li, Z. X., Fan, L., Ge, Z. Y., Wu, J. T., Yang, S. Y.
• Format: Journal Article
• Language: English
• Published: Hoboken Wiley Subscription Services, Inc., A Wiley Company 15-06-2003; Wiley
• Subjects: Applied sciences; electrical properties; Exact sciences and technology; fluorinated poly(amide imide)s; Organic polymers; Physicochemistry of polymers; polycondensation; Polymers with particular properties; Preparation, kinetics, thermodynamics, mechanism and catalysts; solubility; thermal properties; films; Transparency; Solution polycondensation; Electrical properties; Fluorine containing polymer; Dielectric properties; Aromatic polymer; Amidoimide polymer; Mechanical properties; Head to head polymer; fluorinated poly(amide imide)s; Experimental study; Thermal stability; polycondensation; thermal properties; Optical properties; Preparation; Soluble compound; Thermostable; solubility; Water absorption
• ISSN: 0887-624X; 1099-0518
• DOI: 10.1002/pola.10729

A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10−3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003
Fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene (BTTB) and aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane (TMDA), α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane (TFPM), 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene (BTPB), 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine (TBAP), and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane (BTFE)]. The fluorinated poly(amide imide)s had good solubility both in strong aprotic solvents and in common organic solvents. The poly(amide imide) films exhibited high thermal stability associated with good mechanical and electrical properties, and this made them potential candidates for practical applications in the microelectronics industry and other related fields.