Fatigue in wood-based panels. Part 1: The strength variability and fatigue performance of OSB, chipboard and MDF

• Published in: Wood science and technology Vol. 36; no. 3; pp. 255 - 269
• Main Authors: THOMPSON, R. J. H, ANSELL, M. P, BONFIELD, P. W, DINWOODIE, J. M
• Format: Journal Article
• Language: English
• Published: Berlin Springer 01-06-2002; Springer Nature B.V
• Subjects: Applied sciences; Bend strength; Creep (materials); Exact sciences and technology; Mechanical properties; Panels; Particle board; Polymer industry, paints, wood; Wood; Wood-based materials; Wood. Paper. Non wovens; Variability; Mechanical properties; Fatigue; Particleboard; Fiberboard; Experimental study; Oriented strand board
• ISSN: 0043-7719; 1432-5225
• DOI: 10.1007/s00226-001-0136-y

Wood-based panels used as floor decking can be exposed to fatigue as well as creep loading. The strength and fatigue performances of three wood-based panel products OSB, chipboard and MDF have been determined in four-point bending. The mean bending strengths were found to decrease in the following order MDF>OSB>chipboard. The bending strength variation within the OSB was considerably greater than that for chipboard and MDF. Normalised with respect to the static strengths, the fatigue performance of the chipboard was superior to that of the OSB, although the two materials have very similar performances at low stress levels. Normalised with respect to the static strengths, the fatigue performance of the MDF was inferior to both materials and at lower stress levels the fatigue performance deteriorated to a greater extent. However, in terms of absolute applied stress, the fatigue performance of the MDF was superior to that of the OSB, which was superior to that of the chipboard. However, as the stress was reduced the difference between the three materials reduced. At low stresses the performances of the three materials were quite similar.