Electrical Contact Resistance in REBCO Stacks and Cables With Modified Surfaces
Rare-earth barium copper oxide (REBCO) coated conductors are of interest for fabricating high performance cables and magnets for magnetic field B > 22.5 T. One critical challenge is the control of the current sharing between conductor tapes to enable self-protection to take place when a localized...
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Published in: | IEEE transactions on applied superconductivity Vol. 32; no. 6; pp. 1 - 6 |
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Main Authors: | , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
New York
IEEE
01-09-2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
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Summary: | Rare-earth barium copper oxide (REBCO) coated conductors are of interest for fabricating high performance cables and magnets for magnetic field B > 22.5 T. One critical challenge is the control of the current sharing between conductor tapes to enable self-protection to take place when a localized disturbance (hot spot) appears in the cable or magnet coil. Current sharing can be enhanced by reducing the inter-strand contact resistance (ICR). In this work, we explore ICR reduction with several tape surface modification techniques. Under a pressure of 13.3 MPa the contact efficiency , η int of a ten-layer REBCO tape stack was measured to be 106 <inline-formula><tex-math notation="LaTeX">\mu</tex-math></inline-formula>Ω*cm 2 at 4.2 K and 145 µΩ*cm 2 at 77 K. Further increases in pressure had only a small effect on ICR. To further reduce ICR, we proposed two other techniques: (1) Heat treatment of the ten-layer YBCO coated conductor tape stack at 300 °C for 30 min and under various pressures. We concluded that 20 MPa was the minimum pressure required to initiate substantial conductor-to-conductor sintering and an optimum result was achieved by a processing pressure higher than 23.4 MPa which produced η int of 10 µΩ*cm 2 at 4.2 K and 19 µΩ*cm 2 at 77 K when measured under 13.3 MPa. (2) The second approach was to Ni-plate the REBCO tapes. The acidic plating solution removes the native oxide on the Cu surface and the process replaces it with a thin layer of Ni. The result was an η int of 2.7 µΩ*cm 2 at 4.2 K and 4.6 µΩ*cm 2 at 77 K. Both techniques led to η int that were relatively insensitive to changes in temperature. We were able to achieve η int < 10 µΩ*cm 2 with sintering under pressure, and η int < 3 µΩ*cm 2 with Ni electroplating alone. |
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Bibliography: | USDOE Office of Science (SC) SC0011721 |
ISSN: | 1051-8223 1558-2515 |
DOI: | 10.1109/TASC.2022.3165736 |