Enhanced operational stability through interfacial modification by active encapsulation of perovskite solar cells

• Published in: Applied physics letters Vol. 116; no. 11
• Main Authors: Ghosh, Sudeshna, Singh, Roja, Subbiah, Anand S., Boix, Pablo P., Mora Seró, Iván, Sarkar, Shaibal K.
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 16-03-2020
• Subjects: Accumulation; Aluminum oxide; Applied physics; Atomic layer epitaxy; Burn-in; Charge transport; Degradation; Electrical properties; Electrical resistivity; Electronic structure; Encapsulation; Interface stability; Passive components; Perovskites; Photovoltaic cells; Shielding; Solar cells; Tin dioxide
• ISSN: 0003-6951; 1077-3118
• DOI: 10.1063/1.5144038

Encapsulates are, in general, the passive components of any photovoltaic device that provides the required shielding from the externally stimulated degradation. Here we provide comprehensive physical insight depicting a rather non-trivial active nature, in contrast to the supposedly passive, atomic layer deposition (ALD) grown Al2O3 encapsulate layer on the hybrid perovskite [(FA0.83MA0.17)0.95Cs0.05PbI2.5Br0.5] photovoltaic device having the configuration: glass/FTO/SnO2/perovskite/spiro-OMeTAD/Au/(±) Al2O3. By combining various electrical characterization techniques, our experimental observations indicate that the ALD chemistry produces considerable enhancement of the electronic conductivity of the spiro-OMeTAD hole transport medium (HTM), resulting in electronic modification of the perovskite/HTM interface. Subsequently, the modified interface provides better hole extraction and lesser ionic accumulation at the interface, resulting in a significant lowering of the burn-in decay and nearly unchanged charge transport parameters explicitly under the course of continuous operation. Unlike the unencapsulated device, the modified electronic structure in the Al2O3 coated device is essentially the principal reason for better performance stability. Data presented in this communication suggest that the ionic accumulation at the spiro-OMeTAD/perovskite interface triggers the device degradation in the uncoated devices, which is eventually followed by material degradation, which can be avoided by active encapsulation.