Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer
Based on the structure characteristic of Ti₃AlC₂ and the easy formation of Ti₃Al₁ ₋ ₓ SiₓC₂ solid solution, a Si interlayer was selected to join Ti₃AlC₂ layered ceramic by diffusion bonding method. Joining was performed at 1,300–1,400 °C for 120 min under 5 MPa load in an Ar atmosphere. The phase co...
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Published in: | Journal of materials science Vol. 42; no. 17; pp. 7081 - 7085 |
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Main Authors: | , , , |
Format: | Journal Article |
Language: | English |
Published: |
Heidelberg
Kluwer Academic Publishers-Plenum Publishers
01-09-2007
Springer Springer Nature B.V |
Subjects: | |
Online Access: | Get full text |
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Summary: | Based on the structure characteristic of Ti₃AlC₂ and the easy formation of Ti₃Al₁ ₋ ₓ SiₓC₂ solid solution, a Si interlayer was selected to join Ti₃AlC₂ layered ceramic by diffusion bonding method. Joining was performed at 1,300–1,400 °C for 120 min under 5 MPa load in an Ar atmosphere. The phase composition and interface microstructure of the joints were investigated by XRD, SEM and EPMA. The results revealed that Ti₃Al(Si)C₂ solid solution formed at the interface. The mechanism of bonding is attributed to silicon diffusing inward the Ti₃AlC₂. The strength of joints was evaluated by a 3-point bending test. The jointed specimens exhibit a high flexural strength of 285 ± 11 MPa, which is about 80% of that of the Ti₃AlC₂; and retain this strength up to 1,000 °C. The high mechanical performance of the joints indicates that diffusion bonding via a Si interlayer is effective to bond Ti₃AlC₂ ceramic. |
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Bibliography: | http://dx.doi.org/10.1007/s10853-006-1491-8 ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0022-2461 1573-4803 |
DOI: | 10.1007/s10853-006-1491-8 |