Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer

Based on the structure characteristic of Ti₃AlC₂ and the easy formation of Ti₃Al₁ ₋ ₓ SiₓC₂ solid solution, a Si interlayer was selected to join Ti₃AlC₂ layered ceramic by diffusion bonding method. Joining was performed at 1,300–1,400 °C for 120 min under 5 MPa load in an Ar atmosphere. The phase co...

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Bibliographic Details
Published in:Journal of materials science Vol. 42; no. 17; pp. 7081 - 7085
Main Authors: Yin, X. H, Li, M. S, Li, T. P, Zhou, Y. C
Format: Journal Article
Language:English
Published: Heidelberg Kluwer Academic Publishers-Plenum Publishers 01-09-2007
Springer
Springer Nature B.V
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Summary:Based on the structure characteristic of Ti₃AlC₂ and the easy formation of Ti₃Al₁ ₋ ₓ SiₓC₂ solid solution, a Si interlayer was selected to join Ti₃AlC₂ layered ceramic by diffusion bonding method. Joining was performed at 1,300–1,400 °C for 120 min under 5 MPa load in an Ar atmosphere. The phase composition and interface microstructure of the joints were investigated by XRD, SEM and EPMA. The results revealed that Ti₃Al(Si)C₂ solid solution formed at the interface. The mechanism of bonding is attributed to silicon diffusing inward the Ti₃AlC₂. The strength of joints was evaluated by a 3-point bending test. The jointed specimens exhibit a high flexural strength of 285 ± 11 MPa, which is about 80% of that of the Ti₃AlC₂; and retain this strength up to 1,000 °C. The high mechanical performance of the joints indicates that diffusion bonding via a Si interlayer is effective to bond Ti₃AlC₂ ceramic.
Bibliography:http://dx.doi.org/10.1007/s10853-006-1491-8
ObjectType-Article-2
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ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-006-1491-8