Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

• Published in: IEEE photonics journal Vol. 15; no. 5; pp. 1 - 10
• Main Authors: Vlasov, Aleksandr Andreevich, Uusitalo, Topi, Virtanen, Heikki, Viheriala, Jukka, Guina, Mircea
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01-10-2023; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Assembly; Assembly processes; Bonding; Heating systems; infrared imaging; infrared microscopy; Integrated circuits; Interconnections; Laser beams; laser-assisted bonding; Microfluidics; Microscopy; photonic integration; Photonics; Radiation effects; Reconfiguration; Sample holders; Silicon; silicon devices; silicon photonics; Surface treatment; through-silicon vision
• ISSN: 1943-0655; 1943-0647
• DOI: 10.1109/JPHOT.2023.3302404

Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonics. Modern integration processes impose severe requirements on the design and functionality of research and assembly setups and their parts. In this work we demonstrate a simple, reliable, and cost-effective reconfigurable vacuum sample holder that ensures fast reconfiguration for electronic and photonic integration using laser assisted bonding (LAB) processes. The design is compatible with IR through-silicon microscopy with top and bottom irradiation/illumination architectures, which makes this concept instrumental for a large variety of research, assembly, lithography, and wafer bonding setups.