Silicon Thin-Film Formation by Direct Photochemical Decomposition of Disilane

Silicon thin-films have been deposited by the direct photolysis of disilane at a substrate temperature below 300°C. The growth rate depends on irradiation intensity of a low pressure mercury-lamp, and a typical rate of 15 Å/min has been obtained under ∼0.08 watts/cm 2 illumination, regardless of sub...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics Vol. 22; no. 1A; pp. L46 - L48
Main Authors: Mishima, Yasuyoshi, Hirose, Masataka, Osaka, Yukio, Nagamine, Kunihiro, Ashida, Yoshinori, Kitagawa, Nobuhisa, Isogaya, Kazuyoshi
Format: Journal Article
Language:English
Published: 01-01-1983
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Summary:Silicon thin-films have been deposited by the direct photolysis of disilane at a substrate temperature below 300°C. The growth rate depends on irradiation intensity of a low pressure mercury-lamp, and a typical rate of 15 Å/min has been obtained under ∼0.08 watts/cm 2 illumination, regardless of substrate temperature. The deposited films are composed of an amorphous network containing bonded-hydrogen in the range 6–9 at.%. The bonding configurations of SiH groups varied from silicon dihydride to monohydride with increasing substrate temperature, and correspondingly the dark conductivity decreased from 10 -7 to 10 -11 Ω -1 cm -1 . A broad photoluminescence peak at 1.4 eV was observed for a specimen grown at 200°C.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.22.L46