Silicon Thin-Film Formation by Direct Photochemical Decomposition of Disilane
Silicon thin-films have been deposited by the direct photolysis of disilane at a substrate temperature below 300°C. The growth rate depends on irradiation intensity of a low pressure mercury-lamp, and a typical rate of 15 Å/min has been obtained under ∼0.08 watts/cm 2 illumination, regardless of sub...
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Published in: | Japanese Journal of Applied Physics Vol. 22; no. 1A; pp. L46 - L48 |
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Main Authors: | , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
01-01-1983
|
Online Access: | Get full text |
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Summary: | Silicon thin-films have been deposited by the direct photolysis of disilane at a substrate temperature below 300°C. The growth rate depends on irradiation intensity of a low pressure mercury-lamp, and a typical rate of 15 Å/min has been obtained under ∼0.08 watts/cm
2
illumination, regardless of substrate temperature. The deposited films are composed of an amorphous network containing bonded-hydrogen in the range 6–9 at.%. The bonding configurations of SiH groups varied from silicon dihydride to monohydride with increasing substrate temperature, and correspondingly the dark conductivity decreased from 10
-7
to 10
-11
Ω
-1
cm
-1
. A broad photoluminescence peak at 1.4 eV was observed for a specimen grown at 200°C. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/JJAP.22.L46 |