Bond-based peridynamic modeling of composite laminates with arbitrary fiber orientation and stacking sequence

This study presents a new bond-based peridynamic modeling of composite laminates without any limitation to specific fiber orientation and material properties in order to consider arbitrary laminate layups. Unlike the previous models, it also enables the evaluation of stress and strain fields in each...

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Bibliographic Details
Published in:Composite structures Vol. 153; pp. 139 - 175
Main Authors: Hu, Y.L., Madenci, E.
Format: Journal Article
Language:English
Published: Elsevier Ltd 01-10-2016
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Summary:This study presents a new bond-based peridynamic modeling of composite laminates without any limitation to specific fiber orientation and material properties in order to consider arbitrary laminate layups. Unlike the previous models, it also enables the evaluation of stress and strain fields in each ply of the laminate. Therefore, it permits the use of existing stress- or strain-based failure criteria for damage prediction. The orthotropic material behavior is achieved through the use of in-plane normal, in-plane shear, transverse normal and transverse shear peridynamic bonds. These bonds enable the interaction of material points within each ply as well as their interaction with other material points in the adjacent plies. The micromoduli for each bond type are determined for a square domain of interaction. Also, the inhomogeneous nature of composite materials is included by assigning randomized strength parameters based on Gaussian distribution. The PD equilibrium equation is linearized and solved by employing implicit techniques until immediately before failure occurs. The solution continues by using standard explicit time integration techniques until final failure. The capability of this approach is verified against the benchmark solutions, and validated by comparison with the available experimental results for three laminate layups with an open hole under tension and compression.
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ISSN:0263-8223
1879-1085
DOI:10.1016/j.compstruct.2016.05.063