Full-atomistic nanoscale modeling of the ion beam sputtering deposition of SiO2 thin films

• Published in: Journal of non-crystalline solids Vol. 448; pp. 1 - 5
• Main Authors: Grigoriev, F.V., Sulimov, A.V., Katkova, E.V., Kochikov, I.V., Kondakova, O.A., Sulimov, V.B., Tikhonravov, A.V.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 15-09-2016
• Subjects: Atomic structure; Density; Deposition; Ion beam sputtering; Molecular dynamics; Optical films; Silica glass; Silicon; Silicon dioxide; Statistics; Thin films; Silica glass; Molecular dynamics; Optical films; Ion beam sputtering; Deposition
• ISSN: 0022-3093; 1873-4812
• DOI: 10.1016/j.jnoncrysol.2016.06.032

The previously developed high-performance parallel method of the atomistic simulation of the ion beam sputtering deposition process is applied to the SiO2 thin films. Structural properties of deposited films such as density, concentration of point defects, ring statistics, as well as effects arising from the interaction of high energy sputtered Si atoms with the growing film are discussed.
•DESIL force field reproduces structure of glassy silica.•Deposited film density exceeds the density of glassy silica.•Concentration of the point defects decreases with thickness of film.•Film density increases with energy of the deposited atoms.