Flexible integrated OLED substrates prepared by printing and plating process

• Published in: Organic electronics Vol. 50; pp. 170 - 176
• Main Authors: Cho, Doo-Hee, Kwon, O Eun, Park, Young-Sam, Yu, Byoung Gon, Lee, Jonghee, Moon, Jaehyun, Cho, Hyunsu, Lee, Hyunkoo, Cho, Nam Sung
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01-11-2017
• Subjects: Flexible; OLED; Plating; Printing; Substrate; Substrate; Printing; Plating; OLED; Flexible
• ISSN: 1566-1199; 1878-5530
• DOI: 10.1016/j.orgel.2017.07.041

We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels.
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•A cost-effective process to fabricate flexible integrated OLED substrates is proposed.•A screen printing, a copper plating, and lamination/delamination process are used for the flexible integrated substrate.•Performance of the OLED device with the flexible integrated substrate is comparable to that of a glass substrate.