Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

• Published in: Journal of materials science. Materials in electronics Vol. 21; no. 7; pp. 702 - 707
• Main Authors: Tai, F., Guo, F., Xia, Z. D., Lei, Y. P., Shi, Y. W.
• Format: Journal Article
• Language: English
• Published: Boston Springer US 01-07-2010; Springer; Springer Nature B.V
• Subjects: Applied sciences; Brazing. Soldering; Characterization and Evaluation of Materials; Chemistry and Materials Science; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Exact sciences and technology; Hardness; Joining, thermal cutting: metallurgical aspects; Materials Science; Mechanical and acoustical properties of condensed matter; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Mechanical properties of nanoscale materials; Metals. Metallurgy; Nanopowders; Nanoscale materials and structures: fabrication and characterization; Optical and Electronic Materials; Physics; Solder Joint; Solder Alloy; Spacing Distance; Solder Matrix; Composite Solder; Grain size; Strengthening; Intermetallic compounds; Mechanical properties; Solder metal; Spacing; Nanostructures; Microhardness; Nanoparticles; Integrated circuit bonding; Hardening; Tin alloys; Composite materials; Lead free soldering; Lead free solder; Eutectic alloys; Microstructure; Soldered joints
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-009-9981-5

In this research, the typical nano-structured Polyhedral Oligomeric Silsesquioxane (POSS) particles were incorporated into the Sn–3.5Ag eutectic solder paste by mechanically mixing to form lead-free composite solder. The effects of nano-structured POSS additions on the microstructure and mechanical properties of as-fabricated composite solder alloys were systematically investigated. Experimental results indicated that the average size and spacing distance of Ag
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Sn intermetallic compounds (IMCs) in composite solder matrix decreased as compared to the Sn–3.5Ag eutectic solder. The 3 wt% addition of nano-structured POSS particles could enhance the microhardness of composite solder by 18.4% compared with the Sn–3.5Ag eutectic solder matrix. The average grain size and spacing distance of Ag
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Sn IMCs in Sn–Ag + 3 wt% POSS composite solder matrix reduced from 0.35 to 0.23 μm and from 0.54 to 0.32 μm, respectively. The refined Ag
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Sn IMCs, acting as a strengthening phase in the solder matrix, could enhance the microhardness of the composite solders.