Progress in the Molecular Beam Epitaxy of HgCdTe on Large-Area Si and CdZnTe Substrates

This paper presents the progress in the molecular beam epitaxy (MBE) growth of HgCdTe on large-area Si and CdZnTe substrates at Raytheon Vision Systems. We report a very high-quality HgCdTe growth, for the first time, on an 8 cm × 8 cm CdZnTe substrate. This paper also describes the excellent HgCdTe...

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Bibliographic Details
Published in:Journal of electronic materials Vol. 38; no. 8; pp. 1764 - 1770
Main Authors: Reddy, M., Peterson, J. M., Johnson, S. M., Vang, T., Franklin, J. A., Patten, E. A., Radford, W. A., Bangs, J. W., Lofgreen, D. D.
Format: Journal Article Conference Proceeding
Language:English
Published: Boston Springer US 01-08-2009
Springer
Springer Nature B.V
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Summary:This paper presents the progress in the molecular beam epitaxy (MBE) growth of HgCdTe on large-area Si and CdZnTe substrates at Raytheon Vision Systems. We report a very high-quality HgCdTe growth, for the first time, on an 8 cm × 8 cm CdZnTe substrate. This paper also describes the excellent HgCdTe growth repeatability on multiple 7 cm × 7 cm CdZnTe substrates. In order to study the percentage wafer area yield and its consistency from run to run, small lots of dual-band long-wave infrared/long-wave infrared triple-layer heterojunction (TLHJ) layers on 5 cm × 5 cm CdZnTe substrates and single-color double-layer heterojunction (DLHJ) layers on 6-inch Si substrates were grown and tested for cutoff wavelength uniformity and micro- and macrovoid defect density and uniformity. The results show that the entire lot of 12 DLHJ-HgCdTe layers on 6-inch Si wafers meet the testing criterion of cutoff wavelength within the range 4.76 ± 0.1  μ m at 130 K and micro- and macrovoid defect density of ≤50 cm −2 and 5 cm −2 , respectively. Likewise, five out of six dual-band TLHJ-HgCdTe layers on 5 cm × 5 cm CdZnTe substrates meet the testing criterion of cutoff wavelength within the range 6.3 ± 0.1  μ m at 300 K and micro- and macrovoid defect density of ≤2000 cm −2 and 500 cm −2 , respectively, on the entire wafer area. Overall we have found that scaling our HgCdTe MBE process to a 10-inch MBE system has provided significant benefits in terms of both wafer uniformity and quality.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-009-0814-3