Impact of component placement in solder joint reliability
Component placement in an electronic product is usually derived using manufacturability or electromagnetic effects as the defining factors. The effect of placement on component reliability is rarely studied. High integration level of modern products provides advantages in high speed electronics but...
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| Published in: | Microelectronics and reliability Vol. 42; no. 3; pp. 399 - 406 |
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| Main Authors: | , , , |
| Format: | Journal Article |
| Language: | English |
| Published: |
Elsevier Ltd
01-03-2002
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| Online Access: | Get full text |
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| Summary: | Component placement in an electronic product is usually derived using manufacturability or electromagnetic effects as the defining factors. The effect of placement on component reliability is rarely studied. High integration level of modern products provides advantages in high speed electronics but can severely degrade the reliability of components, unless certain design rules are met.
In this paper the relation between placement and the solder joint reliability of a BGA components is studied with computational methods in 3-D and verified with experimental tests. Finite element method is utilized to calculate the accumulation of plastic work in solder joints. Based on the failure criteria obtained in the process, simple design rules are extracted and presented. |
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| Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
| ISSN: | 0026-2714 1872-941X |
| DOI: | 10.1016/S0026-2714(01)00217-7 |