Micro-channel fabrication on silicon wafer (100) using Rotary Ultrasonic Machining

• Published in: SILICON Vol. 14; no. 16; pp. 10271 - 10290
• Main Authors: Mamatha, T. G., Vishnoi, Mohit, Srivastava, Siddharth, Malik, Vansh, Bhatnagar, Mudit K.
• Format: Journal Article
• Language: English
• Published: Dordrecht Springer Netherlands 01-11-2022; Springer Nature B.V
• Subjects: Chemistry; Chemistry and Materials Science; Environmental Chemistry; Experiments; Feed rate; Inorganic Chemistry; Lasers; Material removal rate (machining); Materials Science; Microchannels; Optical Devices; Optics; Original Paper; Particle size; Photonics; Polymer Sciences; Process parameters; Regression analysis; Rotation; Silicon; Silicon wafers; Surface roughness; Ultrasonic machining; Variance analysis; Surface Roughness; Silicon Wafer; Rotary Ultrasonic Machining; Material Removal Rate
• ISSN: 1876-990X; 1876-9918
• DOI: 10.1007/s12633-022-01729-0

In the Present work Rotary Ultrasonic machining is used for fabrication of micro channel on Silicon wafer. Silicon wafer possesses a plethora of applications, from their use in electronics, to energy applications. This experimental research focuses on augmenting the efficiency of machining parameters. The parameters considered are feed rate, rotation speed of the tool and the mesh size of abrasive particle to evaluate Material Removal Rate and Surface Roughness. Analysis of variance has been used to optimise the process parameter.
To correlate the effect of Process parameters on performance the regression analysis is also carried out. The result shows that the rotation speed of the tool and abrasive particle size are the important process parameters which are improving the Performance of Rotary Ultrasonic machining in terms of Material removal rate and Surface roughness.